SOLDER MATERIAL – GOTECH ENGINEERING INDIA http://gotechindia.in Forwarding Technology Mon, 24 May 2021 06:44:53 +0000 en-US hourly 1 https://wordpress.org/?v=6.2.2 Soldering Flux http://gotechindia.in/product/soldering-flux/ Mon, 24 May 2021 06:19:43 +0000 http://gotechindia.in/?post_type=product&p=1161 reducing at elevated temperatures, preventing oxidation of the base and filler materials. Flux serves a threefold purpose: it removes any oxidized metal from the surfaces to be soldered, seals out air thus preventing further oxidation, and by facilitating amalgamation improves wetting characteristics of the liquid solder. Our lead-free flux is usually used in wave soldering process because its wettability is specially designed. It can make the solder joints bright and full. Inside our products, the appropriate amount of solids and internal movement mechanisms can ensure that few residues are found after soldering the circuit board. Moreover, the surface of the circuit board is dry and clean. If there are no special requirements, the product can avoid cleaning procedures, thereby helping manufacturers save a lot of production costs. Due to its excellent soldering performance, our lead-free flux can minimize bridging or other defects during wave soldering. Regarding high-stability soldering of electronic components, this lead-free flux can meet two strict standards, including MIL-P-28809 and IPC-818 standards. Therefore, when used in electronic communication products, computer automation products, computer motherboards, computer interface equipment, etc., it has high reliability. In addition, our products are suitable for wave soldering, foam soldering, spraying soldering and other types of processes. In the foam type welding process, the size of the holes in the foamed oil should be in the range of 0.005mm to 0.01mm. In order to maintain the desired foaming effect, the height of the flux must be at least 1 inch higher than the height of the foam stone. Main features:
  1. The surface remains unchanged before and after welding. It has no residue and no viscosity.
  2. Our lead-free flux does not produce any corrosive residues.
  3. Due to low smoke, the product will not pollute the working environment or affect human health.
  4. The surface insulation resistance is extremely high.
  5. In addition, the product has passed strict copper mirror tests.
]]> reducing at elevated temperatures, preventing oxidation of the base and filler materials. Flux serves a threefold purpose: it removes any oxidized metal from the surfaces to be soldered, seals out air thus preventing further oxidation, and by facilitating amalgamation improves wetting characteristics of the liquid solder. Our lead-free flux is usually used in wave soldering process because its wettability is specially designed. It can make the solder joints bright and full. Inside our products, the appropriate amount of solids and internal movement mechanisms can ensure that few residues are found after soldering the circuit board. Moreover, the surface of the circuit board is dry and clean. If there are no special requirements, the product can avoid cleaning procedures, thereby helping manufacturers save a lot of production costs. Due to its excellent soldering performance, our lead-free flux can minimize bridging or other defects during wave soldering. Regarding high-stability soldering of electronic components, this lead-free flux can meet two strict standards, including MIL-P-28809 and IPC-818 standards. Therefore, when used in electronic communication products, computer automation products, computer motherboards, computer interface equipment, etc., it has high reliability. In addition, our products are suitable for wave soldering, foam soldering, spraying soldering and other types of processes. In the foam type welding process, the size of the holes in the foamed oil should be in the range of 0.005mm to 0.01mm. In order to maintain the desired foaming effect, the height of the flux must be at least 1 inch higher than the height of the foam stone. Main features:
  1. The surface remains unchanged before and after welding. It has no residue and no viscosity.
  2. Our lead-free flux does not produce any corrosive residues.
  3. Due to low smoke, the product will not pollute the working environment or affect human health.
  4. The surface insulation resistance is extremely high.
  5. In addition, the product has passed strict copper mirror tests.
]]> Solder Bar http://gotechindia.in/product/solder-bar/ Sat, 22 May 2021 10:46:41 +0000 http://gotechindia.in/?post_type=product&p=1158
  • Sn63/Pb37
  • Sn60/Pb40
  • Sn50/Pb50
  • Sn55/Pb45
  • Sn45/Pb55
  • Sn40/Pb60
  • Sn35/Pb55
  • Sn30/Pb70
  • Sn25/Pb75
  • Sn20/Pb80
    • Lead free Solder Bar:
    • Sn96.5/Ag 3.0/Cu 0.5
    • Sn99/Ag 0.3/Cu 0.7
    • Sn 99.3/Cu 0.7
    ]]>
  • Sn63/Pb37
  • Sn60/Pb40
  • Sn50/Pb50
  • Sn55/Pb45
  • Sn45/Pb55
  • Sn40/Pb60
  • Sn35/Pb55
  • Sn30/Pb70
  • Sn25/Pb75
  • Sn20/Pb80
    • Lead free Solder Bar:
    • Sn96.5/Ag 3.0/Cu 0.5
    • Sn99/Ag 0.3/Cu 0.7
    • Sn 99.3/Cu 0.7
    ]]>         Solder Wire http://gotechindia.in/product/solder-wire/ Sat, 22 May 2021 10:33:51 +0000 http://gotechindia.in/?post_type=product&p=1154
  • Sn63/Pb37
  • Sn60/Pb40
  • Sn50/Pb50
  • Sn55/Pb45
  • Sn45/Pb55
  • Sn40/Pb60
  • Sn35/Pb55
  • Sn30/Pb70
  • Sn25/Pb75
  • Sn20/Pb80
    • Lead free Solder Wire:
    • Sn96.5/Ag 3.0/Cu 0.5
    • Sn99/Ag 0.3/Cu 0.7
    • Sn64/Bi 35/Ag 1
    • Sn95/Sb 5
    • Sn42/Bi 58
    • Sn 99.3/Cu 0.7
    ]]>
  • Sn63/Pb37
  • Sn60/Pb40
  • Sn50/Pb50
  • Sn55/Pb45
  • Sn45/Pb55
  • Sn40/Pb60
  • Sn35/Pb55
  • Sn30/Pb70
  • Sn25/Pb75
  • Sn20/Pb80
    • Lead free Solder Wire:
    • Sn96.5/Ag 3.0/Cu 0.5
    • Sn99/Ag 0.3/Cu 0.7
    • Sn64/Bi 35/Ag 1
    • Sn95/Sb 5
    • Sn42/Bi 58
    • Sn 99.3/Cu 0.7
    ]]>         Solder Paste http://gotechindia.in/product/solder-paste/ Sat, 22 May 2021 09:30:51 +0000 http://gotechindia.in/?post_type=product&p=1153 Solder Paste is used in the manufacture of printed circuit boards to connect surface mount components to pads on the board. It is also possible to solder through-hole pin in paste components by printing solder paste in and over the holes. The sticky paste temporarily holds components in place; the board is then heated, melting the paste and forming a mechanical bond as well as an electrical connection. The paste is applied to the board by jet printing, stencil printing or syringe; then the components are put in place by a pick-and-place machine or by hand. Gotech offer a wide range of Solder Paste composition as per requirement of customer. Below are some regular composition we are dealing with: Leaded Solder Paste:
    • Sn63/Pb37
    • Sn60/Pb40
    • Sn50/Pb50
    • Sn55/Pb45
    • Sn62/Pb36/Ag2
    Lead free Solder Paste:
    • Sn96.5/Ag 3.0/Cu 0.5
    • Sn99/Ag 0.3/Cu 0.7
    • Sn64/Bi 35/Ag 1
    • Sn42/Bi 57/Ag 1
    • Sn42/Bi 58
    ]]>     Solder Paste is used in the manufacture of printed circuit boards to connect surface mount components to pads on the board. It is also possible to solder through-hole pin in paste components by printing solder paste in and over the holes. The sticky paste temporarily holds components in place; the board is then heated, melting the paste and forming a mechanical bond as well as an electrical connection. The paste is applied to the board by jet printing, stencil printing or syringe; then the components are put in place by a pick-and-place machine or by hand. Gotech offer a wide range of Solder Paste composition as per requirement of customer. Below are some regular composition we are dealing with: Leaded Solder Paste:
    • Sn63/Pb37
    • Sn60/Pb40
    • Sn50/Pb50
    • Sn55/Pb45
    • Sn62/Pb36/Ag2
    Lead free Solder Paste:
    • Sn96.5/Ag 3.0/Cu 0.5
    • Sn99/Ag 0.3/Cu 0.7
    • Sn64/Bi 35/Ag 1
    • Sn42/Bi 57/Ag 1
    • Sn42/Bi 58
    ]]>