Products – GOTECH ENGINEERING INDIA http://gotechindia.in Forwarding Technology Mon, 24 May 2021 13:04:01 +0000 en-US hourly 1 https://wordpress.org/?v=6.2.2 Rice Mill Machinery http://gotechindia.in/product/rice-mill-machinery/ Mon, 24 May 2021 12:52:52 +0000 http://gotechindia.in/?post_type=product&p=1165 Soldering Flux http://gotechindia.in/product/soldering-flux/ Mon, 24 May 2021 06:19:43 +0000 http://gotechindia.in/?post_type=product&p=1161 reducing at elevated temperatures, preventing oxidation of the base and filler materials. Flux serves a threefold purpose: it removes any oxidized metal from the surfaces to be soldered, seals out air thus preventing further oxidation, and by facilitating amalgamation improves wetting characteristics of the liquid solder. Our lead-free flux is usually used in wave soldering process because its wettability is specially designed. It can make the solder joints bright and full. Inside our products, the appropriate amount of solids and internal movement mechanisms can ensure that few residues are found after soldering the circuit board. Moreover, the surface of the circuit board is dry and clean. If there are no special requirements, the product can avoid cleaning procedures, thereby helping manufacturers save a lot of production costs. Due to its excellent soldering performance, our lead-free flux can minimize bridging or other defects during wave soldering. Regarding high-stability soldering of electronic components, this lead-free flux can meet two strict standards, including MIL-P-28809 and IPC-818 standards. Therefore, when used in electronic communication products, computer automation products, computer motherboards, computer interface equipment, etc., it has high reliability. In addition, our products are suitable for wave soldering, foam soldering, spraying soldering and other types of processes. In the foam type welding process, the size of the holes in the foamed oil should be in the range of 0.005mm to 0.01mm. In order to maintain the desired foaming effect, the height of the flux must be at least 1 inch higher than the height of the foam stone. Main features:
  1. The surface remains unchanged before and after welding. It has no residue and no viscosity.
  2. Our lead-free flux does not produce any corrosive residues.
  3. Due to low smoke, the product will not pollute the working environment or affect human health.
  4. The surface insulation resistance is extremely high.
  5. In addition, the product has passed strict copper mirror tests.
]]> reducing at elevated temperatures, preventing oxidation of the base and filler materials. Flux serves a threefold purpose: it removes any oxidized metal from the surfaces to be soldered, seals out air thus preventing further oxidation, and by facilitating amalgamation improves wetting characteristics of the liquid solder. Our lead-free flux is usually used in wave soldering process because its wettability is specially designed. It can make the solder joints bright and full. Inside our products, the appropriate amount of solids and internal movement mechanisms can ensure that few residues are found after soldering the circuit board. Moreover, the surface of the circuit board is dry and clean. If there are no special requirements, the product can avoid cleaning procedures, thereby helping manufacturers save a lot of production costs. Due to its excellent soldering performance, our lead-free flux can minimize bridging or other defects during wave soldering. Regarding high-stability soldering of electronic components, this lead-free flux can meet two strict standards, including MIL-P-28809 and IPC-818 standards. Therefore, when used in electronic communication products, computer automation products, computer motherboards, computer interface equipment, etc., it has high reliability. In addition, our products are suitable for wave soldering, foam soldering, spraying soldering and other types of processes. In the foam type welding process, the size of the holes in the foamed oil should be in the range of 0.005mm to 0.01mm. In order to maintain the desired foaming effect, the height of the flux must be at least 1 inch higher than the height of the foam stone. Main features:
  1. The surface remains unchanged before and after welding. It has no residue and no viscosity.
  2. Our lead-free flux does not produce any corrosive residues.
  3. Due to low smoke, the product will not pollute the working environment or affect human health.
  4. The surface insulation resistance is extremely high.
  5. In addition, the product has passed strict copper mirror tests.
]]> Solder Bar http://gotechindia.in/product/solder-bar/ Sat, 22 May 2021 10:46:41 +0000 http://gotechindia.in/?post_type=product&p=1158
  • Sn63/Pb37
  • Sn60/Pb40
  • Sn50/Pb50
  • Sn55/Pb45
  • Sn45/Pb55
  • Sn40/Pb60
  • Sn35/Pb55
  • Sn30/Pb70
  • Sn25/Pb75
  • Sn20/Pb80
    • Lead free Solder Bar:
    • Sn96.5/Ag 3.0/Cu 0.5
    • Sn99/Ag 0.3/Cu 0.7
    • Sn 99.3/Cu 0.7
    ]]>
  • Sn63/Pb37
  • Sn60/Pb40
  • Sn50/Pb50
  • Sn55/Pb45
  • Sn45/Pb55
  • Sn40/Pb60
  • Sn35/Pb55
  • Sn30/Pb70
  • Sn25/Pb75
  • Sn20/Pb80
    • Lead free Solder Bar:
    • Sn96.5/Ag 3.0/Cu 0.5
    • Sn99/Ag 0.3/Cu 0.7
    • Sn 99.3/Cu 0.7
    ]]>         Solder Wire http://gotechindia.in/product/solder-wire/ Sat, 22 May 2021 10:33:51 +0000 http://gotechindia.in/?post_type=product&p=1154
  • Sn63/Pb37
  • Sn60/Pb40
  • Sn50/Pb50
  • Sn55/Pb45
  • Sn45/Pb55
  • Sn40/Pb60
  • Sn35/Pb55
  • Sn30/Pb70
  • Sn25/Pb75
  • Sn20/Pb80
    • Lead free Solder Wire:
    • Sn96.5/Ag 3.0/Cu 0.5
    • Sn99/Ag 0.3/Cu 0.7
    • Sn64/Bi 35/Ag 1
    • Sn95/Sb 5
    • Sn42/Bi 58
    • Sn 99.3/Cu 0.7
    ]]>
  • Sn63/Pb37
  • Sn60/Pb40
  • Sn50/Pb50
  • Sn55/Pb45
  • Sn45/Pb55
  • Sn40/Pb60
  • Sn35/Pb55
  • Sn30/Pb70
  • Sn25/Pb75
  • Sn20/Pb80
    • Lead free Solder Wire:
    • Sn96.5/Ag 3.0/Cu 0.5
    • Sn99/Ag 0.3/Cu 0.7
    • Sn64/Bi 35/Ag 1
    • Sn95/Sb 5
    • Sn42/Bi 58
    • Sn 99.3/Cu 0.7
    ]]>         Solder Paste http://gotechindia.in/product/solder-paste/ Sat, 22 May 2021 09:30:51 +0000 http://gotechindia.in/?post_type=product&p=1153 Solder Paste is used in the manufacture of printed circuit boards to connect surface mount components to pads on the board. It is also possible to solder through-hole pin in paste components by printing solder paste in and over the holes. The sticky paste temporarily holds components in place; the board is then heated, melting the paste and forming a mechanical bond as well as an electrical connection. The paste is applied to the board by jet printing, stencil printing or syringe; then the components are put in place by a pick-and-place machine or by hand. Gotech offer a wide range of Solder Paste composition as per requirement of customer. Below are some regular composition we are dealing with: Leaded Solder Paste:
    • Sn63/Pb37
    • Sn60/Pb40
    • Sn50/Pb50
    • Sn55/Pb45
    • Sn62/Pb36/Ag2
    Lead free Solder Paste:
    • Sn96.5/Ag 3.0/Cu 0.5
    • Sn99/Ag 0.3/Cu 0.7
    • Sn64/Bi 35/Ag 1
    • Sn42/Bi 57/Ag 1
    • Sn42/Bi 58
    ]]>     Solder Paste is used in the manufacture of printed circuit boards to connect surface mount components to pads on the board. It is also possible to solder through-hole pin in paste components by printing solder paste in and over the holes. The sticky paste temporarily holds components in place; the board is then heated, melting the paste and forming a mechanical bond as well as an electrical connection. The paste is applied to the board by jet printing, stencil printing or syringe; then the components are put in place by a pick-and-place machine or by hand. Gotech offer a wide range of Solder Paste composition as per requirement of customer. Below are some regular composition we are dealing with: Leaded Solder Paste:
    • Sn63/Pb37
    • Sn60/Pb40
    • Sn50/Pb50
    • Sn55/Pb45
    • Sn62/Pb36/Ag2
    Lead free Solder Paste:
    • Sn96.5/Ag 3.0/Cu 0.5
    • Sn99/Ag 0.3/Cu 0.7
    • Sn64/Bi 35/Ag 1
    • Sn42/Bi 57/Ag 1
    • Sn42/Bi 58
    ]]>         Industrial Silicone Sealants & Adhesives http://gotechindia.in/product/industrial-silicone-sealants-adhesives/ Thu, 20 May 2021 17:58:42 +0000 http://gotechindia.in/?post_type=product&p=1140 PSAs) have a wide variety of uses in the manufacture of tapes and labels. They can deliver excellent adhesion to a wide range of surfaces subject to harsh thermal and chemical conditions, including low surface energy materials such as silicones, fluoropolymers and polyolefins.]]> PSAs) have a wide variety of uses in the manufacture of tapes and labels. They can deliver excellent adhesion to a wide range of surfaces subject to harsh thermal and chemical conditions, including low surface energy materials such as silicones, fluoropolymers and polyolefins.]]> Thermal Conductive Adhesive http://gotechindia.in/product/thermal-conductive-adhesive-2/ Thu, 20 May 2021 17:01:48 +0000 http://gotechindia.in/?post_type=product&p=1074 Silicone Conformal Coating http://gotechindia.in/product/silicone-conformal-coating/ Thu, 20 May 2021 06:55:56 +0000 http://gotechindia.in/?post_type=product&p=1087 Conformal coating material is a thin polymeric film which conforms to the contours of a printed circuit board to protect the board's components. Typically applied at 25-250 μm(micrometers) thickness, it is applied to electronic circuitry to protect against moisture, dust, chemicals, and temperature extremes.  Coatings can be applied in a number of ways, including brushing, spraying, dispensing and dip coating We offer Momentive Conformal Coatings. Maintaining the appearance and functionality of a surface requires a coating that delivers protection from harsh weather, high temperatures and abrasive chemicals. Momentive’s specialty coatings portfolio offers this line of defense for an array of hardcoat, weatherstrip, anti-fog, release and electronic applications. Our coatings can provide excellent thermal, chemical, solvent and abrasion resistance, as well as improved adhesion to substrates for applications from automotive lighting, exterior trim and interior parts, to sensitive electronic components, tapes and Momentive’s ECC3011 and ECC3051S silicone conformal coating materials employ a distinct formulation that helps prevent the occurrence of corrosion on vital PCB components and surfaces. These coating materials have been shown to dispel the commonly held perception that silicones, due to their higher gas permeability, are at a disadvantage in corrosion prevention. In corrosion tests performed by Momentive in accordance with IEC standards, Momentive’s new silicone formulations out-performed a select group of conformal coating materials,  including acrylics, polyurethane, polyolefin and competitor silicone formulations.

    Key Features and Typical Benefits:

    • Fast tack-free time
    • Solvent-free formulation (100% solid content)
    • UV indicator for ease of inspection under black light
    • Continuous operating temperature range of -40 ~ 150 °C

    Applicable Standards

    Tested in accordance with IPC-CC-830B / MIL-I-46058C  ]]>     Conformal coating material is a thin polymeric film which conforms to the contours of a printed circuit board to protect the board's components. Typically applied at 25-250 μm(micrometers) thickness, it is applied to electronic circuitry to protect against moisture, dust, chemicals, and temperature extremes.  Coatings can be applied in a number of ways, including brushing, spraying, dispensing and dip coating We offer Momentive Conformal Coatings. Maintaining the appearance and functionality of a surface requires a coating that delivers protection from harsh weather, high temperatures and abrasive chemicals. Momentive’s specialty coatings portfolio offers this line of defense for an array of hardcoat, weatherstrip, anti-fog, release and electronic applications. Our coatings can provide excellent thermal, chemical, solvent and abrasion resistance, as well as improved adhesion to substrates for applications from automotive lighting, exterior trim and interior parts, to sensitive electronic components, tapes and Momentive’s ECC3011 and ECC3051S silicone conformal coating materials employ a distinct formulation that helps prevent the occurrence of corrosion on vital PCB components and surfaces. These coating materials have been shown to dispel the commonly held perception that silicones, due to their higher gas permeability, are at a disadvantage in corrosion prevention. In corrosion tests performed by Momentive in accordance with IEC standards, Momentive’s new silicone formulations out-performed a select group of conformal coating materials,  including acrylics, polyurethane, polyolefin and competitor silicone formulations.

    Key Features and Typical Benefits:

    • Fast tack-free time
    • Solvent-free formulation (100% solid content)
    • UV indicator for ease of inspection under black light
    • Continuous operating temperature range of -40 ~ 150 °C

    Applicable Standards

    Tested in accordance with IPC-CC-830B / MIL-I-46058C  ]]>         Potting Compound http://gotechindia.in/product/potting-compound/ Thu, 20 May 2021 06:50:57 +0000 http://gotechindia.in/?post_type=product&p=1086 Electronics, Potting is a process of filling a complete electronic assembly with a solid or gelatinous compound for high voltage assemblies by excluding gaseous phenomena such as corona discharge, for resistance to shock and vibration, and for the exclusion of water, moisture, or corrosive agents. Thermosetting plastics or silicone rubber gels are often used, though epoxy resins are also very common. When potting a circuit board that uses surface-mount technology, low glass transition temperature potting compounds such as polyurethane or silicone may be used, because high glass transition temperature like epoxy potting compounds may break solder bonds through solder fatigue because by hardening at a higher temperature. GOTECH offer  Silicone Potting compound as well as Polyurethane Potting compound. GOTECH’s dielectric potting and encapsulation materials are principally used to protect electronic components from moisture and harmful contaminants. These materials can help provide stress relief protection to circuits from thermal, vibration, and mechanical stress. GOTECH offers a range of materials including one- and two-part products and specialized grades that offer thermal conductivity, flame retardancy, and low volatiles. We also supply Momentive’s Silicone Potting Compound. Momentive's industrial gels and encapsulants offer higher performance, increased miniaturization and long-term dependability for potting, bonding and sealing applications designed to protect, isolate and embed delicate electronic circuitry. Momentive’s SilCool*, InvisiSil*, Silopren* and SilTRUST* gels and encapsulants, as well as our room temperature vulcanization (RTV) sealants, protect fragile components against mechanical and thermal shock. The products offer a range of benefits, including: fast room temperature cure, electrical stability, stress relief, thermal dissipation and high electro-conductivity in adhesives. Momentive helps foster scientific advances in numerous manufacturing sectors, including the automotive, display, appliance, lighting, power, gaming and packaging industries. Another example is the solar industry, where Momentive's SilTRUST E110 encapsulant can enable new cell and module technologies that are incompatible with more traditional encapsulation materials.]]> Electronics, Potting is a process of filling a complete electronic assembly with a solid or gelatinous compound for high voltage assemblies by excluding gaseous phenomena such as corona discharge, for resistance to shock and vibration, and for the exclusion of water, moisture, or corrosive agents. Thermosetting plastics or silicone rubber gels are often used, though epoxy resins are also very common. When potting a circuit board that uses surface-mount technology, low glass transition temperature potting compounds such as polyurethane or silicone may be used, because high glass transition temperature like epoxy potting compounds may break solder bonds through solder fatigue because by hardening at a higher temperature. GOTECH offer  Silicone Potting compound as well as Polyurethane Potting compound. GOTECH’s dielectric potting and encapsulation materials are principally used to protect electronic components from moisture and harmful contaminants. These materials can help provide stress relief protection to circuits from thermal, vibration, and mechanical stress. GOTECH offers a range of materials including one- and two-part products and specialized grades that offer thermal conductivity, flame retardancy, and low volatiles. We also supply Momentive’s Silicone Potting Compound. Momentive's industrial gels and encapsulants offer higher performance, increased miniaturization and long-term dependability for potting, bonding and sealing applications designed to protect, isolate and embed delicate electronic circuitry. Momentive’s SilCool*, InvisiSil*, Silopren* and SilTRUST* gels and encapsulants, as well as our room temperature vulcanization (RTV) sealants, protect fragile components against mechanical and thermal shock. The products offer a range of benefits, including: fast room temperature cure, electrical stability, stress relief, thermal dissipation and high electro-conductivity in adhesives. Momentive helps foster scientific advances in numerous manufacturing sectors, including the automotive, display, appliance, lighting, power, gaming and packaging industries. Another example is the solar industry, where Momentive's SilTRUST E110 encapsulant can enable new cell and module technologies that are incompatible with more traditional encapsulation materials.]]> Thermal Gap Filler http://gotechindia.in/product/thermal-gap-filler/ Thu, 20 May 2021 06:42:45 +0000 http://gotechindia.in/?post_type=product&p=1084
  • TIA225GF gap filler
  • SilCool TIA241GF gap filler
  • TIA223G-DG gap fille
    • ]]>
  • TIA225GF gap filler
  • SilCool TIA241GF gap filler
  • TIA223G-DG gap fille
    • ]]>