Solder Paste is used in the manufacture of printed circuit boards to connect surface mount components to pads on the board. It is also possible to solder through-hole pin in paste components by printing solder paste in and over the holes. The sticky paste temporarily holds components in place; the board is then heated, melting the paste and forming a mechanical bond as well as an electrical connection. The paste is applied to the board by jet printing, stencil printing or syringe; then the components are put in place by a pick-and-place machine or by hand.

Gotech offer a wide range of Solder Paste composition as per requirement of customer. Below are some regular composition we are dealing with:

Leaded Solder Paste:

• Sn63/Pb37
• Sn60/Pb40
• Sn50/Pb50
• Sn55/Pb45
• Sn62/Pb36/Ag2

Lead free Solder Paste:

• Sn96.5/Ag 3.0/Cu 0.5
• Sn99/Ag 0.3/Cu 0.7
• Sn64/Bi 35/Ag 1
• Sn42/Bi 57/Ag 1
• Sn42/Bi 58