Advantages of organic thermal silicon encapsulant in electronic potting

There are three main types of power module potting: epoxy resin potting, silicone potting, and polyurethane potting. Among them, silicone potting glue has the following advantages:

There are three main types of power module potting: epoxy resin potting, silicone potting, and polyurethane potting. Among them, silicone potting glue has the following advantages:
(1) Low viscosity, good leveling, suitable for molding of complex electronic parts.
(2) After curing, it forms a soft rubbery shape and has good impact resistance.
(3) Excellent heat resistance, moisture resistance and cold resistance, and can extend the life of electronic components after application.
(4) Addition molding, curing at room temperature and heating
(5) It has excellent moisture and water resistance.

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