It’s a kind of “non thermal conductive glue” and get to fill in many places in Electronics and Automotive Industry, sometimes where we need to fill empty gap, sometimes we do potting with it in circuit to bear mechanical shock or electrical shock.

Gotech suppies Momentive Gap filler as per customer needs. Momentive’s SilCool* gap fillers are used to fill air gaps and voids to enhance heat transfer, and are excellent candidates for applications where low stress and good interface wetting are required. These products further offer tacky adhesion for applications where movements in x, y, and z directions occur due to vibration, thermal cycling stress and CTE (coefficient of thermal expansion) mismatch. SilCool gap fillers offer exceptional performance in terms of reliability, adhesion, and thermal resistance. While initially proposed for automotive applications (e.g. automotive electronic control units and systems) SilCool gap fillers can also be considered for use in consumer and telecommunication or HMI applications where heat must to be removed efficiently.

• TIA225GF gap filler
• SilCool TIA241GF gap filler
• TIA223G-DG gap fille